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Q:统一一下灯珠的翻译口径
1 F. t* H1 l$ `- B0 y8 {5 H/ Z# d贴片灯珠:SMD chip,可用LED chip代指,当然LED chip可以泛指所有的LED灯珠,别用LED bead,很土。除了COB以外的大功率集成芯片,用LED array更合适点,当然也可以说integrated array。光源、散热、驱动、光学部件一体的叫LED light engine,CREE网站上也叫LED module。如果你怕误译,就直接LED,比如RGB灯珠,一般翻译成RGB LEDs% O$ s ~+ h, }% d1 l# M3 W
A:chip是芯片,一般说成是晶元,我不认为这种翻译正确,osram chips。# o& y- Z5 a; D; U
Q:裸片叫LED die
* }- {, X Z |A:裸片叫wafer i" d9 D- p% V& S- b b: Z' D
Q:封装好的叫LED package,但一般都说成LED chip
# G5 n, X" A2 I) j- d9 ]LED die - A small, block of light-emitting semi-conducting material on which a functional LED circuit is fabricated. & {* I; j- W+ ~ M) A
% c' y4 {. _1 GLED package -An assembly of one or more LED dies that includes wire bond or other type of electricai connections, possibly with an optical element and thermal, mechanical, and electrical interfaces.
0 {9 I: i. T6 w) ZA: die是晶元,wafer晶片,老外不怎么说led package。
; u) y3 E0 Z$ H9 t- y6 ]$ C& m6 ?Q:我说的裸片是没有封装过的,led package是IES的标准解释。 |
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